TechLead Corporation

Packaging, Interconnection & Assembly

 
  • Increase font size
  • Default font size
  • Decrease font size

Rising Claim Counts - Patently-O Blog 23 Dec 2007

E-mail Print PDF
From the Patently-O Blog by Dennis Crouch

Patent.Law050

The chart shows the average number of total claims and independent claims for each year of issuance. The sample is drawn from 28,000 randomly selected patents that issued from 1977 and 2005. (For those who want data, the following table shows the average claim numbers by filing date.)

http://www.patentlyo.com/patent/2007/12/rising-claim-co.html


Last Updated ( Friday, 28 December 2007 10:10 )
 

Dominique Numakura Newsletter - Nov 8, 2007

The analogy between Ichiro Suzuki and Toyota Motors

I am trying to think of an analogy between Ichiro Suzuki, a star player for the Seattle Mariners and Toyota Motors, the largest automobile manufacturer in Japan.

Ichiro Suzuki is not a typical Major League Baseball slugger. His mission at the plate is not to hit homeruns, but get on base as much as possible. He seldom swings for the fence.

Last Updated ( Tuesday, 08 April 2008 06:37 ) Read more...
 

Court Blocks Patent Office From Instituting Controversial Rules

The USPTO says the rules are intended to speed reviews, but critics say they would limit patent protection.

By Paul McDougall,  InformationWeek
Oct. 31, 2007
URL: Link
Copyright © 2007 CMP Media LLC

A federal judge on Wednesday enjoined the U.S. Patent and Trademark Office from instituting new rules, scheduled to take effect Nov. 1, that critics say would limit the level of patent protection available to inventors.

Ruling on a motion filed by pharmaceutical company GlaxoSmithKline, which is suing the Patent Office over the issue, Judge James Cacheris of the U.S. Court for the Eastern District of Virginia blocked, for now at least, the patent office from implementing the regulations Thursday as planned.

"This is a sign that the challenge to these rules is legitimate," said Mark Murphy, a Chicago-based patent attorney whose firm, Cook Alex, is not involved in the litigation.

The new rules are intended to speed patent reviews by the chronically understaffed USPTO. Among other things, they limit so-called "continuing applications" through which inventors can modify existing patent applications.

Last Updated ( Friday, 09 November 2007 10:21 ) Read more...
 

The IP Landscape for 3D Semiconductor Assembly;

Forum: SMTA International 2007

Charles E. Bauer, Ph.D., Herbert J. Neuhaus, Ph.D. & Florin Ciontu*, TechLead Corporation, *NanoSprint

Abstract:  The semiconductor industry only recently recognized the power of the third dimension in package and system assembly, yet the intellectual property (IP) aspects of this field already encompass more than 3000 patents worldwide as well as a wide variety of enabling technologies not directly identified as 3D techniques!  The authors review the relevant IP and organize it by generic technology categories such as chip stacks, origami and package on package (PoP). 

Last Updated ( Thursday, 08 November 2007 14:02 ) Read more...
 

Cost Analysis of 3D Semiconductor Assembly Alternatives

Forum: SMTA International 2007

Charles E. Bauer, Ph.D., & Herbert J. Neuhaus, Ph.D., TechLead Corporation

Abstract:  Many alternative technologies compete in the arena of 3D assembly and packaging, each competitor claiming performance and cost advantages. While 3D semiconductor assembly has evolved to be largely compatible with existing manufacturing infrastructure, the complex interactions of substrate, device and assembly yields make direct cost comparisons difficult.

Recently the authors reported a methodology to accurately predict relative manufacturing costs for technology alternatives in cases with no manufacturing yield data available.

Last Updated ( Tuesday, 06 November 2007 19:43 ) Read more...
 

Contact Information

Chuck Bauer
TechLead Corporation
31321 Island Drive
Evergreen, CO 80439
+1-303-674-8202
e-mail: Chuck Bauer
Skype Me™!

Herb Neuhaus
TechLead Corporation
770 Maroonglen Court
Colorado Springs, CO 80906
+1-719-210-1040
e-mail: Herb Neuhaus
My status

Site Login


Packaging News from Semiconductor International

  • Release Film Boosts IC Molding Productivity
    Asahi Glass has developed a release film for molding thin ball grid arrays (BGAs) or chip-scale packages (CSPs). The company said the film reduces resin usage, and nearly eliminates the frequent mold cleanings required with conventional molding technologies.
  • Molding Techniques Support Thin Gold Wires, Low-k Materials
    Competing Japan-based molding machine manufacturers have developed techniques that support the thinner packages required for cell phones. The new molding methods also ease the mechanical pressure placed on the relatively fragile low-k dielectric materials in leading-edge logic devices.
  • The Mobile Life: Carry Small, Live Large
    In his keynote address, “The Mobile Renaissance: The Era of Smarter SoCs,” Gadi Singer, vice president of the Mobility Group and general manager of the SoC Enabling Group at Intel (Santa Clara, Calif.), shared his compelling vision on the future of the mobile industry.