Blurring the Line between Packaging & Assembly: Embedded Components
Location
SMTAI 2009, San Diego, California, October 2009
Overview
Embedding active and passive components in the interconnect substrate offers improved performance by cutting interconnect parasitics, reliability gains by eliminating wire-bonds and solder-bumps, and reduced cost and size by parts list reduction. Like every new development, these benefits come at a price: disrupted logistics, yield management concerns, and limited rework and repair options.
This course covers the application and implementation of commercial and developmental technologies to embed active as well as passive components. Topics include advanced material options, die contact metallurgy and processes, embedded chip packaging, and options for embedded passives. Solutions include ceramic-based (thick film, LTCC, and HTCC) and organic-based (PWB, flex, and thin film) systems Examples of specific embedded component structures, including Verdant’s Occam and Freescale’s RCP technologies, demonstrate both the power and limitations of these approaches.
Further considerations for embedded components include yield management strategies, WEEE and ROHS concerns, system reliability, and supply chain restructuring. The course concludes by reviewing the drivers behind embedded active and passive components and analysis of multiple examples of today’s real life embedded component applications.
Topics
- Embedded Component Drivers & Trends
- Embedding Active Components
- Bare Die
- Packaged Die
- Embedding Passive Components
- Discrete Passives
- Integral Passives
- Commercial & Developmental Applications
- Technical & Business Implications for SMT Assemblers
- Process Changes & Revised Yield Management Strategies
- Supply Chain Shift & Value Capture Opportunities
- Cost Analysis for Embedded Components
- Embedded Packaging Intellectual Property Landscape
Who Should Attend?
This course covers basic and advanced topics for product and design engineers, manufacturing process and assembly/packaging engineers, engineering managers, senior design technicians, consultants and academic specialists as well as marketing and sales personnel requiring an understanding of the capabilities, implications and options of embedded active and passive component technologies.
Instructor Bio:
Herbert J. Neuhaus, Ph.D. serves as Director of Operations at TechLead Corporation supporting clients around the world in the areas of intellectual property management and valuation, technical cost modeling as well as developing advanced strategic planning tools. Active since 1980 in the development and characterization of electronic materials and associated manufacturing processes for a wide variety of applications including flip-chip for RFID and Smart Cards, LED assembly, chip interconnect and passivation, multichip modules, printed wiring boards, and flat panel displays, Dr. Neuhaus synthesized a unique perspective on electronics packaging, interconnection and assembly industry.
Dr. Neuhaus received his Ph.D. degree in Reliability Physics from the Massachusetts Institute of Technology and the prestigious distinction of Fellow of the Society of the International Microelectronics and Packaging Society (IMAPS). He currently chairs the materials subcommittee of the IMAPS National Technical Committee and serves on the Board of Vyta Corp.
