TechLead Corporation

Raymond A. Fillion serves as Director, Advanced Technology for TechLead Corporation, a technology management company specializing in the electronics packaging, interconnection and assembly industry. Ray focuses in the areas of packaging and interconnect technology in addition to intellectual property strategy. During 40 years with GE, Ray accumulated expertise in Power, 3-D, Embedded Chip, Microwave and Chip Scale Packaging as well as MultiChip Modules (MCMs), Wafer Scale Integration, High Density Interconnect, Integral Passives, Polymer Processing, and Surface Mount Technology.

Ray authored more than 160 technical papers and journal articles and his research efforts resulted in 25 issued US patents. He regularly contributes to IEEE MCM, ECTC, IMAPS, the Symposium of Polymers in Microelectronics and Pan Pacific Microelectronics Conferences. He serves on several Technical Advisory Boards, including Georgia Tech PRC, SUNY Binghamton IEEC, Endicott Interconnect, and DOE Solid State Lighting Initiative. He received numerous GE and industry awards including the GE Whitney Award for the development of Nano-filled, thermal interface materials. He teaches microelectronic courses at GE, SMTA, Cornell, Georgia Tech and SUNY Binghamton.

 

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