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Recent TechLead publications
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1 The IP Landscape for Photovoltaics
2 Global Outsourcing -- Winning Strategy for Vietnam: Imitation to Innovation
3 The IP Landscape for 3D Semiconductor Assembly;
4 Package-on-Package IP Landscape
5 Edge Stacked Modules: COTS compatible 3D Package Architecture with Integral Thermal Management
6 Cost Analysis of 3D Semiconductor Assembly Alternatives
 
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Chuck Bauer
TechLead Corporation
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Ray Fillion
TechLead Corporation
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Herb Neuhaus
TechLead Corporation
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e-mail: Herb Neuhaus
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