TechLead Corporation

Packaging, Interconnection & Assembly

 
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Home About TechLead

About TechLead

TechLead Corporation, an international engineering and management consulting firm based in Portland, Oregon, USA, provides a broad range of products and services in strategic planning, business and operations management as well as market and product development within the areas of electronics packaging, interconnection and assembly. Clients include high technology companies throughout the Pacific Basin, North America and Europe.

TechLead's staff of seasoned professionals combines unique and extensive knowledge with more than 140 years of in-depth industry experience to translate data into information and knowledge into understanding yielding insight and support for your company’s most demanding business and technology needs.

  • Products   ( 1 Articles )
    Techlead products
  • Services   ( 1 Articles )
    TechLead Corporation's purpose for existence is to support and enhance the continued success of its clients in the electronics packaging, interconnect and assembly industry.  To this end TechLead provides expert services in four broad areas of activity; technology, business and market development, and education.

    Technology

    TechLead provides strategic technology planning, selection and implementation services through technology audits, technical due diligence, technology assessment and benchmarking.  Special areas of expertise include integrated circuit packaging, advanced printed wiring boards and multichip module substrates as well as surface mount, chip on board and other advanced assembly techniques.  These skills have been applied for a broad range of products including materials and equipment for component, sub-system and system level applications.  Product families include portable, medical, automotive, consumer and industrial products of all types.   TechLead brings more than 60 years of manufacturing and R&D experience to bear on strategic technology issues.

    Business & Market Development

    With more than 6,500 contacts throughout the world in the packaging, interconnect and assembly industry TechLead is well qualified to execute detailed market analysis.  This includes competitive assessments, market intelligence, market niche targeting, business planning and budgeting, and strategic relationship brokering.  The interpretation and forecasting of market and technology interactions and critical introduction of strategic customers are particular skills that TechLead provides.  These activities result in the opening of closed markets, expansion of existing markets and most opportunely the creation of new markets.  Our forte is converting data and knowledge to information and understanding!!

    Education

    TechLead regularly presents seminars, workshops and tutorials in Asia, Europe and North America on a variety of topics germane to the packaging, interconnect and assembly industry.  Specific opportunities include Chip Scale and Ball Grid Array Packaging, Advanced Build Up Printed Wiring Boards and MultiChip Modules, Electronic Design for Manufacturing and Assembly, Simplified Automatic Process Control and SPC in the technical arena.  On the business and market front TechLead offers insightful courses on Marketing in the Pacific Basin, Management of Technology and Innovation, and Communication and Business Across Cultural Barriers.
  • Education   ( 3 Articles )
    TechLead workshops & seminars
  • Publications   ( 6 Articles )
    Recent TechLead publications
  • Clients   ( 1 Articles )
  • Partners & Associates   ( 3 Articles )
    TechLead partners & associates

Contact Information

Chuck Bauer
TechLead Corporation
4120 NW Niblick Place
Portland, OR 97229
+1-303-674-8202
e-mail: Chuck Bauer
Skype Me™!

Ray Fillion
TechLead Corporation
31 Chestnut Lane
Niskayuna, NY  12309
+1-518-810-1519
e-mail: Ray Fillion
Skype Me™!

Herb Neuhaus
TechLead Corporation
770 Maroonglen Court
Colorado Springs, CO 80906
+1-719-210-1040
e-mail: Herb Neuhaus
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