3 Dimensional Assembly, Packaging & Integration

Location

SMTAI 2009, San Diego, California, October 2009

Overview

The latest trend in miniaturization of electronics systems, 3D assembly and packaging of both active and passive devices opens a new world of performance and integration to system designers.  This course covers both the fundamental and advanced technologies in use today to produce stacked chip packages as well as stackable packages for implementation of highly integrated mobile electronic products.  These include the challenges of die thinning, thin die attach, multi-level wire bonding, mixed technology die attachment and bonding, flip chip, TAB and TSV (Through Silicon Via) technologies.  Substrate selection for various 3D packaging techniques including silicon tiles, flex circuit origami and specialty interposers concludes the chip stacking section of the course.  Several examples of specific 3D package structures demonstrate both the power and limitations of these approaches.

Further considerations for 3D electronics include stackable packages based on flex and rigid substrate approaches, integrated system in package (SiP) techniques and multilayer, embedded passive technologies.  Additional coverage of SMT design and assembly implications rounds out the technical content of the course. The course concludes with a review of the drivers behind 3D packaging and presentation of multiple examples of 3D packages in actual usage today.

Topics

• 3D Package Trends
• 3D Package Applications
• Stacked Packages
  • Package on Package
  • Origami
  • Edge Stacked Modules
• Die Stacking
  • Wire Bond
  • Mixed Technology
  • Edge Redistribution
  • Through Silicon Vias
• 3D Integration (SiP)
• Issues in 3D Integration
• SMT Assembly Implications
• Drivers for 3D Packaging
• Intellectual Property Landscape for 3D Packaging

Who Should Attend?

This course covers basic and advanced topics for product and design engineers, manufacturing process and assembly/packaging engineers, engineering managers, senior design technicians, consultants and academic specialists as well as marketing and sales personnel requiring an understanding of the capabilities, implications and options of 3D packaging and assembly technologies.

Instructor Biography

Charles E. Bauer, Ph.D. serves as Senior Managing Director of TechLead Corporation, a technology management company specializing in the electronics packaging, interconnection and assembly industry.  Dr. Bauer focuses in the areas of strategic technology planning, market analysis and business development, primarily in the international arena.  With more than 30 years experience spanning the range from printed circuit board and hybrid fabrication through complex IC metallization, multilayer packaging, multichip modules (MCMs) and flat panel display packaging and assembly he brings tremendous breadth and depth to his work.  Dr. Bauer lectures throughout the world on technology, business and market topics as well as serving on several corporate boards and international corporate, government and educational institution advisory councils.

Chuck served ISHM as President of the NW Chapter, Technical Chair of the ISHM National Symposium in Seattle, National Technical Vice President of the Society and President of the Rocky Mountain Chapter.  He founded the ISHM/IMAPS Advanced Technology Workshop program and served as General or Technical chair for several ATWs between 1990 and 1998.  Founder of the Pan Pacific Microelectronics Symposium, Dr. Bauer also served on the Board of Directors of the SMTA from 1997 through 2001 when elected President of IMAPS for 2001-2002.  He now serves as Chair of the SMTA International Development Committee and remains active internationally with the SMTA, IEEE, IMAPS, JIEP and ASM.