Charles E. Bauer, Ph.D. serves as Senior Managing Director of TechLead Corporation, a technology management company specializing in the electronics packaging, interconnection and assembly industry. Dr. Bauer focuses in the areas of strategic technology planning, market analysis and business development, primarily in the international arena. With more than 20 years experience spanning the range from printed circuit board and hybrid fabrication through complex IC metallization, multilayer packaging, multichip modules (MCMs) and flat panel display packaging and assembly he brings tremendous breadth and depth to his work. Dr. Bauer lectures throughout the world on technology, business and market topics as well as serving on several corporate boards and international corporate, government and educational institution advisory councils.
Chuck served ISHM as President of the NW Chapter, Technical Chair of the ISHM National Symposium in Seattle, National Technical Vice President of the Society and President of the Rocky Mountain Chapter. He founded the ISHM/IMAPS Advanced Technology Workshop program and served as General or Technical chair for several ATWs between 1990 and 1998. Dr. Bauer also served on the Board of Directors of the SMTA from 1997 through 2001 when elected President of IMAPS for 2001-2002. He now serves as Chair of the SMTA International Development Committee and remains active internationally with the SMTA, IEEE, IMAPS, JIEP and ASM.